美國UDM AKLC300系列晶圓切削液

美國UDM AKLC300系列濃縮晶圓切削液 ? AKLC300洗滌劑濃縮液是一種可生物降解、水性、非堿性、非酸性物質(zhì)? PV wafer Cleaning after wafering 用于切片之后對光伏硅片進(jìn)行清洗? DI /RO water: Detergent dilution ratio – 1000:1 to 500 :1 去離子水/反滲透水:洗滌劑溶液比例 – 1000:1至500:1 ? Application temperature: 45°C - 70°C 使用溫度：45°C - 70°C ? Excellent wetting, cleaning and rinsing properties 極好的濕潤、清潔和沖洗功能? Water surface tension reducer 降低去離子水/反滲透水表面張力? Completely cleans out SiC (silicon carbide) dust and other contaminants on wafer surfaces 可以徹底清潔硅片表面的碳化硅(SiC)塵埃以及其他臟污? Cleans and eliminates Cu (Copper) and Fe (Iron) on PV wafer surfaces after wafering and De-gluing process. 在切片以及去膠工序之后徹底清除光伏硅片表面的銅和鐵? Biodegradable, non-hazardous and hence easily disposable 可生物降解、無危害，可以很容易進(jìn)行處置? Biochemical Oxygen Demand (BOD) < 2.0 mg/L (BOD less than 2.0 mg/L) 生化需氧量(BOD) < 2.0 mg/L (BOD小于2.0 mg/L) ? Chemical Oxygen Demand (COD) < 10.0 mg/L (COD less than 10.0 mg/L) 化學(xué)需氧量(COD) < 10.0 mg/L (COD小于10.0 mg/L) 聯(lián)系人：陳先生手機(jī)：13602588976